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Method for manufacturing semiconductor device 发明申请

2023-09-25 4640 180K 0

专利信息

申请日期 2025-06-27 申请号 JP2014146702
公开(公告)号 JP2014225684A 公开(公告)日 2014-12-04
公开国别 JP 申请人省市代码 全国
申请人 SEMICONDUCTOR ENERGY LAB
简介 PROBLEM TO BE SOLVED : To provide a semiconductor device using an oxide semiconductor in which miniaturization of a transistor is achieved and electric field relaxation is realized.SOLUTION : In a method for manufacturing a semiconductor device, width of a gate electrode is shrunken, and a space between a source electrode layer and a drain electrode layer is narrowed. Since a low-resistivity region in contact with a channel formation region can be provided in an oxide semiconductor layer by adding rare gas in a self-aligned manner using the gate electrode as a mask, the low-resistivity region can be provided with high alignment accuracy, even if the width of the gate electrode, that is, line width of gate wiring, is shrunken, thereby miniaturization of a transistor is achieved.


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