| 申请日期 | 2025-06-25 | 申请号 | WOCN14078066 |
| 公开（公告）号 | WO2014187330A1 | 公开（公告）日 | 2014-11-27 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | SHENZHEN BYD AUTO R D COMPANY LIMITED; BYD COMPANY LIMITED | ||
| 简介 | A circuit board and a method for fabricating the same are provided. The circuit board comprises : an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof. | ||
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