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High purity erbium, erbium sputtering target consisting of high purity, high purity and erbium met 发明授权

2023-08-25 1900 145K 0

专利信息

申请日期 2025-06-29 申请号 JP2013522674
公开(公告)号 JP5623643B2 公开(公告)日 2014-11-12
公开国别 JP 申请人省市代码 全国
申请人 JX Nippon Mining amp; Metals Co Ltd502362758
简介 High-purity erbium having a purity of 5N or higher excluding rare earth elements and gas components, and containing Al, Fe, Cu, and Ta each in an amount of 1 wtppm or less, W in an amount of 10 wtppm or less, carbon in an amount of 150 wtppm or less, alkali metals and alkali earth metals each in an amount of 1 wtppm or less, other transition metal elements in a total amount of 10 wtppm or less, and U and Th as radioactive elements each in an amount of 10 wtppb or less. An object of this invention is to provide a method of highly purifying erbium, which has a high vapor pressure and is difficult to refine in a molten state, as well as technology for efficiently and stably providing high-purity erbium obtained with the foregoing method, a sputtering target made of high-purity erbium, and a metal gate film having high-purity erbium as a main component thereof.


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