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METHOD FOR ETCHING FILM INCLUDING TRANSITION METAL 发明申请

2023-10-05 3740 98K 0

专利信息

申请日期 2025-07-17 申请号 JP2014005194
公开(公告)号 JP2014209552A 公开(公告)日 2014-11-06
公开国别 JP 申请人省市代码 全国
申请人 TOKYO ELECTRON LTD; TOHOKU UNIV
简介 PROBLEM TO BE SOLVED : To provide a method for etching a film including a transition metal using a substrate processing device. SOLUTION : A substrate processing device comprises : a processing container defining a processing chamber and a plasma generating chamber; and a shielding part provided between the processing chamber and the plasma generating chamber, including a plurality of openings for communicating between the processing chamber and the plasma generating chamber, and having shielding properties to ultraviolet light. A method for etching a film including a transition metal using a substrate processing device comprises : (a) a step ST1 of supplying neutral particles of an oxygen atom to a processing chamber housing a workpiece having the film by generating plasma of a first gas containing oxygen in the plasma generating chamber; (b) a step ST2 of supplying a second gas for complexing the oxidized transition metal to the processing chamber; and (c) a step ST3 of supplying neutral particles of a rare gas atom to the processing chamber by generating plasma of a rare gas in the plasma generating chamber. COPYRIGHT : (C)2015, JPO&INPIT


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