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Selectively molding method of electroless plating layer. 发明授权

2023-11-19 4730 89K 0

专利信息

申请日期 2026-04-24 申请号 JP2010118757
公开(公告)号 JP5604692B2 公开(公告)日 2014-10-15
公开国别 JP 申请人省市代码 全国
申请人 Sankyo Kasei Co Ltd175504
简介 PROBLEM TO BE SOLVED : To mitigate time and effort of removing dirt at a part covered with a mask; to save resources of a catalyst made of rare metal; and to obtain firm adhesion.SOLUTION : A primary molded article 1 on a hydrophobic surface is molded by injection molding of a liquid crystal polymer including a filler. A secondary molded article 3 is molded by injection molding of a mask 2 made of hydrolysable polyglycolic acid-based resin having a function of absorbing or blocking ultraviolet rays 4 so as to cover the primary molded article 1 with the mask 2 except a part 11 to be plated. The ultraviolet rays 4 are emitted to the whole surface of the secondary molded article 3 under an oxygen atmosphere, and surface modification is selectively carried out on an exposed part of the primary molded article 1. Thereafter, the mask 2 is removed by an alkali aqueous solution. The primary molded article 1 from which the mask 2 is removed is immersed in the catalyst liquid to give the catalyst 5 to a surface-modified part. Next, the primary molded article 1 is immersed in electroless copper plating liquid so as to mold an electroless plating layer 6 selectively on the surface-modified part.


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