| 简介 |
The present invention provides a colloidal silica polishing composition containing a colloidal solution including a spherical colloidal silica grain and assembling colloidal silica grain. According to the present invention, a quicker polishing rate compared to an existing polishing using colloidal silica can be obtained. High planarization can be obtained by preventing micro defects of a substrate surface. Also, it can be replaced with a polishing material of cesium oxide when a lap surface is polished. Recently, a problem of rare earth elements can be solved.COPYRIGHT KIPO 2015 |
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