| 申请日期 | 2025-06-26 | 申请号 | JP2014523397 |
| 公开（公告）号 | JP2014524354A | 公开（公告）日 | 2014-09-22 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | Alpha Metals Inc | ||
| 简介 | A lead-free solder alloy, comprising : from 35 to 59 %wt Bi; from 0.01 to 0.5 %wt Ni; one or both of : from 0.05 to 1.0 %wt Cu, and from 0.01 to 1.0 wt% Ag; from 0 to 1.0 %wt Sb; and the balance Sn, together with any unavoidable impurities being not more than 1.0 wt.%. | ||
|
您还没有登录，请登录后查看下载地址
|
客服热线：
手机版
二维码
