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Semiconductor device and method of forming same 发明授权

2023-11-26 3630 217K 0

专利信息

申请日期 2025-06-27 申请号 JP2010075677
公开(公告)号 JP5583448B2 公开(公告)日 2014-09-03
公开国别 JP 申请人省市代码 全国
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION
简介 A method of forming a semiconductor device is provided that includes forming a Ge-containing layer atop a p-type device regions of the substrate. Thereafter, a first dielectric layer is formed in a second portion of a substrate, and a second dielectric layer is formed overlying the first dielectric layer in the second portion of the substrate and overlying a first portion of the substrate. Gate structures may then formed atop the p-type device regions and n-type device regions of the substrate, in which the gate structures to the n-type device regions include a rare earth metal.


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