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THERMALLY CONDUCTIVE RESIN COMPOSITION EXCELLENT IN HEAT RESISTANCE AND HEAT DISSIPATION COMPONENT U 发明申请

2023-03-05 3130 214K 0

专利信息

申请日期 2025-07-19 申请号 JP2013014085
公开(公告)号 JP2014145024A 公开(公告)日 2014-08-14
公开国别 JP 申请人省市代码 全国
申请人 TAIKA : KK
简介 PROBLEM TO BE SOLVED : To provide a thermally conductive resin composition which is improved in heat resistance or thermal degradation resistance in a low-oxygen atmosphere by containing a specific thermal stabilizer, and to provide a heat dissipation component using the same. SOLUTION : The thermally conductive resin composition for a low-oxygen heating environment, which is obtained by dispersing at least a thermally conductive filler (B) and a thermal stabilizer (C) in a resin (A) and is used in a low-oxygen heating environment, is characterized in that : the thermal stabilizer (C) is a rare earth oxide of a body-centered cubic crystal structure (or a C-type rare earth oxide); and the content of the C-type rare earth oxide is 0.005-100 pts.wt. based on 100 pts.wt. of the resin (A). COPYRIGHT : (C)2014, JPO&INPIT


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