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METHOD OF MANUFACTURING CERAMIC ELECTRONIC COMPONENT AND CERAMIC ELECTRONIC COMPONENT 发明申请

2023-08-15 2460 113K 0

专利信息

申请日期 2025-08-19 申请号 JP2013206147
公开(公告)号 JP2014143392A 公开(公告)日 2014-08-07
公开国别 JP 申请人省市代码 全国
申请人 MURATA MFG CO LTD
简介 PROBLEM TO BE SOLVED : To provide a method of manufacturing a ceramic electronic component in which a short circuit between internal electrodes is less likely to occur. SOLUTION : Raw ceramic layers 29a and 29b which contain ceramic particles and in which the total amount of at least one of Ba, Mg, Mn, and rare earths present among the ceramic particles is larger than that of a ceramic part are formed on first and second side surfaces 24c and 24d of a raw ceramic element body 23, respectively. The raw ceramic element body 23 provided with the raw ceramic layers 29a and 29b is fired to obtain a ceramic electronic component 1 having an electronic component body 10 obtained by firing the raw ceramic element body 23 provided with the raw ceramic layers 29a and 29b. COPYRIGHT : (C)2014, JPO&INPIT


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