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Laser cooling of modified SOI wafer 发明授权

2023-06-01 2880 2371K 0

专利信息

申请日期 2025-06-25 申请号 US12966394
公开(公告)号 US8794010B2 公开(公告)日 2014-08-05
公开国别 US 申请人省市代码 全国
申请人 David L Williams; Andrew Clark; Michael Lebby
简介 A laser cooling system includes a substrate, an REO layer of single crystal rare earth oxide including at least one rare earth element positioned on the surface of the substrate, and an active layer of single crystal semiconductor material positioned on the REO layer to form a semiconductor-on-insulator (SOI) device. Light guiding structure is at least partially formed by the REO layer so as to introduce energy elements into the REO layer and produce cooling by anti-Stokes fluorescence. The active layer of single crystal semiconductor material is positioned on the REO layer in proximity to the light guiding structure so as to receive the cooling.


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