| 简介 |
Provided is a method for manufacturing a ceramic electronic component with significantly reduced risk of short-circuiting between inner electrodes. Raw ceramic layers (29a, 29b) are formed on each of first and second lateral surfaces (24c, 24d) of a raw ceramic body (23), wherein the raw ceramic layers contain ceramic particles and more of at least one constituent selected from Ba, Mg, Mn, and a rare-earth element between the ceramic particles than a ceramic section of the raw ceramic body in terms of total amount. By firing the raw ceramic body (23) provided with the raw ceramic layers (29a, 29b), a ceramic electronic component (1) is obtained, which has an electronic component main body (10) left after the raw ceramic body (23) is fired with the raw ceramic layers (29a, 29b).COPYRIGHT KIPO 2014 |
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