申请日期 | 2025-07-08 | 申请号 | JP2008080822 |
公开(公告)号 | JP5527937B2 | 公开(公告)日 | 2014-06-25 |
公开国别 | JP | 申请人省市代码 | 全国 |
申请人 | Kyocera Corporation6633 | ||
简介 | A silicon nitride cutting tool comprising a sintered product is disclosed. The sintered product comprises silicon nitride, at least one rare earth element compound, and a magnesium compound. The silicon nitride cutting tool further comprises a surface region and an inside region comprising the sintered product with varying content ratios of component compounds to provide enhanced wear and fracture resistance. |
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