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PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE 发明申请

2023-01-03 1700 3321K 0

专利信息

申请日期 2025-07-08 申请号 WOJP13075555
公开(公告)号 WO2014057793A1 公开(公告)日 2014-04-17
公开国别 WO 申请人省市代码 全国
申请人 TOKYO ELECTRON LIMITED
简介 In a plasma processing device according to an embodiment, the energy of microwaves is introduced from an antenna through a dielectric window into a processing chamber. This plasma processing device includes a central introduction section and a peripheral introduction section. The central introduction opening of the central introduction section opens toward the center of the placement area of a placement table on which a substrate is placed and a gas is jetted through the central introduction opening immediately below the dielectric window. A plurality of peripheral introduction openings of the peripheral introduction section are arranged in a circumferential direction below the central introduction opening and above the placement table, and a gas is jetted through the peripheral introduction openings toward the edges of the placement area. A plurality of first gas sources that include a reactive-gas source and a rare-gas source are connected to the central introduction section through a plurality of first flow rate control units. A plurality of second gas sources that include a reactive-gas source and a rare-gas source are connected to the peripheral introduction section through a plurality of second flow rate control units.


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