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METHOD OF SUPERCONDUCTOR SPLICING BY PRESSURIZED SOLID STATE ATOMS DIFFUSION USING DIRECT CONTACT OF 发明授权

2023-05-16 3160 446K 0

专利信息

申请日期 2025-09-18 申请号 KR1020130034862
公开(公告)号 KR101386587B1 公开(公告)日 2014-04-11
公开国别 KR 申请人省市代码 全国
申请人 K JOINS
简介 A superconductor pressurization solid state atom diffusion splicing method using direct contact of a superconductive layer and a stabilizing layer is disclosed. A superconductor splicing method according to the present invention, as a superconductor splicing method splicing a first superconductor and a second superconductor, includes : a step (a) of preparing a substrate, a superconductive layer formed on the substrate with ReBCO (ReBa2Cu3O7-x, Re is a rare-earth element, 0[Reference numerals] (AA) Start; (BB) End; (S110) Prepare a first superconductor and a second superconductor; (S120) Remove part of a stabilizing layer of the first superconductor; (S130) Attach a superconductive layer of the first superconductor to a stabilizing layer of the superconductor; (S140) Attachment through pressurization; (S150) Thermal treatment for oxygen recoveryCOPYRIGHT KIPO 2014


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