| 申请日期 | 2026-04-28 | 申请号 | WOUS14000125 |
| 公开（公告）号 | WO2015023312A2 | 公开（公告）日 | 2015-02-19 |
| 公开国别 | WO | 申请人省市代码 | 全国 |
| 申请人 | NATIONAL INSTITUTE OF AEROSPACE ASSOCIATES; USA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION | ||
| 简介 | A novel radiation hardened chip package technology protects microelectronic chips and systems in aviation/space or terrestrial devices against high energy radiation. The proposed technology of a radiation hardened chip package using rare earth elements and multilayered structure provides protection against radiation bombardment from alpha and beta particles to neutrons and high energy electromagnetic radiation. | ||
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