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POLISHING MATERIAL PARTICLES, METHOD FOR PRODUCING POLISHING MATERIAL, AND POLISHING PROCESSING ME 发明申请

2023-02-03 3060 3103K 0

专利信息

申请日期 2025-07-09 申请号 WOJP14069830
公开(公告)号 WO2015019888A1 公开(公告)日 2015-02-12
公开国别 WO 申请人省市代码 全国
申请人 KONICA MINOLTA INC
简介 The present invention addresses the problem of providing : polishing material particles which have polishing performance suitable for precision polishing and also have a high polishing speed and high monodispersibility; a polishing material containing the polishing material particles; and a polishing processing method using the polishing material. The polishing material particles according to the present invention are characterized by being spherical particles having an average aspect ratio of 1.00 to 1.15, wherein the particle diameter (D50 (nm)) of the polishing material particles as determined from a particle diameter cumulative distribution curve falls within the range from 50 to 1500 nm, and the average content of cerium or the total content of cerium and at least one element selected from lanthanum (La), praseodymium (Pr), neodymium (Nd), samarium (Sm) and europium (Eu) in the polishing material particles is 81 mol% or more relative to the total content of all of rare earth elements that constitute the polishing material particles.


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