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Sputtering target for oxide thin film and process for producing the sputtering target 发明授权

2023-11-28 4240 3697K 0

专利信息

申请日期 2025-06-25 申请号 US12996598
公开(公告)号 US8623511B2 公开(公告)日 2014-01-07
公开国别 US 申请人省市代码 全国
申请人 Hirokazu Kawashima; Koki Yano; Futoshi Utsuno; Kazuyoshi Inoue
简介 Disclosed is a sputtering target that can suppress the occurrence of anomalous discharge in the formation of an oxide semiconductor film by sputtering method and can continuously and stably form a film. Also disclosed is an oxide for a sputtering target that has a rare earth oxide C-type crystal structure and has a surface free from white spots (a poor appearance such as concaves and convexes formed on the surface of the sputtering target). Further disclosed is an oxide sintered compact that has a bixbyite structure and contains indium oxide, gallium oxide, and zinc oxide. The composition amounts (atomic %) of indium (In), gallium (Ga), and zinc (Zn) fall within a composition range satisfying the following formula : In/(In+Ga+Zn)<0.75.


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