| 简介 |
The present invention relates to a wafer processing body, a wafer processing member, a temporary adhesive material for wafer processing, and a thin wafer manufacturing method using the same, wherein the wafer processing body maintains cleaning effect after being peeled off and has an appropriate releasing power. The temporary adhesive material for wafer processing according to the present invention includes a first temporary adhesive layer which includes a R21R22R23SiO1/2 unit and a SiO4/2 unit and comprises a thermoplastic resin-modified organopolysiloxane layer and a second temporary adhesive layer which comprises a thermo-cured resin modified siloxane polymer layer.COPYRIGHT KIPO 2014 |
客服热线：
手机版
二维码
