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The semiconductor device, and a method of manufacturing a semiconductor device 发明授权

2023-08-31 4370 1769K 0

专利信息

申请日期 2025-06-24 申请号 JP2009033840
公开(公告)号 JP5336877B2 公开(公告)日 2013-11-06
公开国别 JP 申请人省市代码 全国
申请人 Toshiba3078
简介 A semiconductor device includes : a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge


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