客服热线:18202992950

METHOD OF FORMING SILVER STABILIZER OF REBCO COATED CONDUCTORS USING ELECTROPLATING 发明授权

2023-03-01 2570 509K 0

专利信息

申请日期 2025-06-24 申请号 KR1020110055346
公开(公告)号 KR101322815B1 公开(公告)日 2013-10-22
公开国别 KR 申请人省市代码 全国
申请人 JOINS K
简介 PURPOSE : A method for forming a silver stabilizer of an REBCO coated conductor using electroplating and an REBCO coated conductor manufactured by the same are provided to obtain a very thick stabilizer by coating silver on the surface of the REBCO coated conductor using electroplating easy to control thickness. CONSTITUTION : A method for forming a silver stabilizer of an REBCO coated conductor using electroplating comprises the steps of : preparing an REBCO coated conductor including a REBCO(ReBa2Cu3O(7-x), where Re is rare-earth material, 0<=x<=0.6) coated layer, and electro-plating silver on the surface of the REBCO coated conductor to 10-40μm using electrolyte containing 0.1-3.0 M of silver ion.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4