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The thermosetting resin and epoxy resin adduct 发明申请

2023-07-24 3880 296K 0

专利信息

申请日期 2025-06-28 申请号 JP2013531615
公开(公告)号 JP2013538918A 公开(公告)日 2013-10-17
公开国别 JP 申请人省市代码 全国
申请人 Dow Global Technologies LLC502141050
简介 An epoxy resin adduct including the reaction product of (A) at least one polyfunctional aliphatic or cycloaliphatic epoxy resin; and (B) at least one reactive compound; wherein the polyfunctional aliphatic or cycloaliphatic epoxy resin is isolated from the epoxy resin formed by the epoxidation of (i) an aliphatic or cycloaliphatic hydroxyl-containing material using (ii) an epi-halohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (v) optionally one or more solvents; and wherein the re-active compound (B) comprises one or more compounds having two or more reactive hydrogen atoms per molecule and the reactive hydrogen atoms are reactive with epoxide groups. A curable epoxy resin composition includes the adduct described above. A cured epoxy resin is prepared by a process of curing the curable epoxy resin composition containing the adduct described above.


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