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Laminated ceramic electronic components 发明授权

2023-07-18 2970 543K 0

专利信息

申请日期 2025-07-22 申请号 JP2008212844
公开(公告)号 JP5315856B2 公开(公告)日 2013-10-16
公开国别 JP 申请人省市代码 全国
申请人 Murata Manufacturing Co Ltd6231
简介 PROBLEM TO BE SOLVED : To solve the following problem : when a ceramic laminate provided in a multilayer ceramic electronic component is made thin, stress is apt to concentrate on a boundary between a part covered with an external electrode and a part which is not covered owing to a swell of a glass component from the external electrode and then a crack is apt to occur. SOLUTION : Ceramic constituting a protective layer 14 providing a surface layer portion defining an external surface of the ceramic laminate 3 and a body portion 15 other than the protective layer 14 has a composition which contains in common as a principal component a perovskite type compound expressed by ABO3(wherein A contains Ba, or Ba and at least one of Ca and Sr, and B contains Ti, or Ti and at least one of Zr and Hf), and contains Si as an accessory component, however the composition of the protective layer 14 is higher in A/B ratio than the composition of the body portion 15, and also made larger in Mg content or rare earth element content to increase the Si concentration of the protective layer 14. COPYRIGHT : (C)2010, JPO&INPIT


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