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METHOD FOR REDUCING MAPPING OF ELECTRODEPOSITED COATING LAYER 发明授权

2023-01-28 3040 246K 0

专利信息

申请日期 2025-06-26 申请号 RU2012101246
公开(公告)号 RU2495162C2 公开(公告)日 2013-10-10
公开国别 RU 申请人省市代码 全国
申请人 PPG INDASTRIZ OGAJO INK
简介 FIELD : metallurgy. SUBSTANCE : coating includes two layers. The first coating layer is deposited from the first coating composition containing the following : (i) compound of metal of group IIIB, compound of metal of group IVB or their combination. The second coating layer is deposited from the second coating composition containing the following : (a) resin with reactive functional groups, which contains ionic saline group with active hydrogen, (b) linking agent showing reaction activity in relation to at least one of reactive functional resin groups, and (c) soluble alkali-earth metal that is contained in the quantity of not more than 1000 p/mln in terms of total weight of the second coating composition. EFFECT : invention allows reducing mapping of a coating layer applied to a substrate. 21 cl, 4 ex


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