| 申请日期 | 2026-01-14 | 申请号 | US12399709 |
| 公开（公告）号 | US8530058B1 | 公开（公告）日 | 2013-09-10 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Nikhilesh Chawla; Martha Dudek | ||
| 简介 | A lead free solder consisting of a ternary eutectic composition of Sn-3.9Ag-0.7Cu with Ce in the amount of 0.5 to 2% by weight exhibits improved oxidation resistance increased ductility in comparison with other RE metals and is characterized by a homogeneous mixture of large grain CeSn3 intermetallics in a Sn beta phase. In solder applications, the joints with the solder are resistance to interfacial fracture by distributing the strain within the solder interface increasing impact resistance. | ||
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