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TRANSIENT LIQUID PHASE, PRESSURELESS JOINING OF ALUMINUM NITRIDE COMPONENTS 发明申请

2023-05-25 1050 1315K 0

专利信息

申请日期 2025-06-28 申请号 WOUS13028473
公开(公告)号 WO2013130918A1 公开(公告)日 2013-09-06
公开国别 WO 申请人省市代码 全国
申请人 HARRIS Jonathan H; POLESE Frank J; TESCH Robert J; NOOTENS Stephen P; DINESCU Sorin; BRADBURY William L
简介 A monolithic, hermetic joining or bonding of two or more aluminum nitride ("AIN") ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AIN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y203) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together, in a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication. The components can have a plurality of embedded metallized electronic traces which can be electrically interconnected across the interface between the components.


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