| 简介 |
A bonding material (12), which is composed of a sheet-like molded body containing fine particles of a compound composed of a metal element or a semi-metal element and a nonmetal element, is disposed between material pieces (10A, 10B) to be bonded, which are composed of a ceramic composed of the compound, and layers (11A, 11B) composed only of a metal element or a semi-metal element are disposed between the material pieces (10A, 10B) and the bonding material (12), and a multilayer structure (20) is formed. Then, in a state wherein a load is applied to the multilayer structure (20), the multilayer structure (20) is fired under the atmosphere of the non-metal element or under the atmosphere of a compound containing the non-metal element, and a bonded body (1) is formed. The bonded body (1) is heat-treated under the load equivalent to or lower than that applied when firing is performed. |
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