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The copper alloy plate and its manufacturing method 发明授权

2023-11-18 2550 250K 0

专利信息

申请日期 2026-04-26 申请号 JP2008258837
公开(公告)号 JP5261122B2 公开(公告)日 2013-08-14
公开国别 JP 申请人省市代码 全国
申请人 DOWA Metal Tech Co Ltd506365131
简介 PROBLEM TO BE SOLVED : To provide a Cu-Ni-Si based copper alloy sheet having little anisotropy while holding high strength of ≥700 MPa tensile strength and excellent bending workability, and a method for manufacturing therefor. SOLUTION : The copper alloy sheet includes the composition composed, by mass%, of 0.7-4% Ni, 0.2-1.0% Si and if necessary, one or more of 0.1-1.2% Sn, ≤2.0% Zn, and ≤1.0% Mg, and furthermore, ≤3% total of one or more elements selected from group composed of Co, Cr, B, P, Fe, Zr, Ti, Mn, Ag, Be and misch metal and the balance Cu with inevitable impurities. In the copper alloy sheet, in the case of being an integral intensity of ähkl} diffraction peak when an X-ray diffraction is applied on the sheet surface, is Iähkl}, this copper alloy sheet includes a crystal orientation satisfying Iä200}/Iä422}≥15. COPYRIGHT : (C)2010, JPO&INPIT


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