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A copper-based alloy material and structure using the same 发明申请

2023-09-30 3500 781K 0

专利信息

申请日期 2025-06-24 申请号 JP2012518235
公开(公告)号 JPWO2011152009A1 公开(公告)日 2013-07-25
公开国别 JP 申请人省市代码 全国
申请人 Japan copper center508370337
简介 A copper-based alloy which contains 7.8 to 8.8 mass% of Al, 7.2 to 14.3 mass% of Mn and a remainder made up by Cu and unavoidable impurities, has a largest crystal grain diameter of more than 8 mm, has good shape memory properties, and enables the production of a structural material having a cross-section size suitable for use as a structure body or the like; and a structural material comprising the copper-based alloy. The copper-based alloy may additionally contain at least one element selected from the group consisting of Ni, Co, Fe, Ti, V, Cr, Si, Ge, Nb, Mo, W, Sn, Bi, Sb, Mg, P, Be, Zr, Zn, B, C, S, Ag and a misch metal in the total amount of 0.001 to 5 mass%.


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