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Semiconductor device and manufacturing method thereof 发明授权

2023-03-01 4830 325K 0

专利信息

申请日期 2025-06-24 申请号 JP2009026604
公开(公告)号 JP5232035B2 公开(公告)日 2013-07-10
公开国别 JP 申请人省市代码 全国
申请人 Toshiba3078
简介 PROBLEM TO BE SOLVED : To provide a semiconductor device having a gate insulating film which has a high dielectric constant and can reduce a leakage current. ŽSOLUTION : The semiconductor device includes a first dielectric film 23 provided on a semiconductor substrate 11 and containing lantern aluminum silicon oxide or oxynitride, a second dielectric film 24 provided on the first dielectric film 23 and containing oxide or oxynitride containing at least one of hafnium (Hf), zirconium (Zr), titanium (Ti), and rare-earth metal, and an electrode 14 provided on the second dielectric film 24. ŽCOPYRIGHT : (C)2010, JPO&INPIT Ž


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