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Method for manufacturing semiconductor device 发明授权

2023-06-24 4760 433K 0

专利信息

申请日期 2025-06-28 申请号 JP2006226023
公开(公告)号 JP5235051B2 公开(公告)日 2013-07-10
公开国别 JP 申请人省市代码 全国
申请人 Semiconductor Energy Laboratory Co Ltd153878
简介 PROBLEM TO BE SOLVED : To provide a method for gettering a metal element for accelerating crystallization by forming an amorphous silicon film containing a rare gas at high speed without damaging to a crystalline semiconductor film. ŽSOLUTION : The crystalline semiconductor film containing an element for accelerating crystallization of a semiconductor film is formed on a substrate having an insulating surface. An oxide film is formed on the crystalline semiconductor film. By using a plasma processing apparatus for generating a plasma having the electron temperature of 0.5 eV to 1.5 eV and the electron concentration of 1.0×1011cm-3to 1.0×1013cm-3, the amorphous silicon film containing a rare gas element is formed on the oxide film, and then the crystalline semiconductor film, the oxide film and the amorphous silicon film containing the rare gas are heated to remove the element for accelerating crystallization of the semiconductor film from the crystalline semiconductor film, in a method for manufacturing a semiconductor device. ŽCOPYRIGHT : (C)2007, JPO&INPIT Ž


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