| 简介 |
PROBLEM TO BE SOLVED : To provide a novel bonded structure manufactured by bonding various kinds of carbon films and metal materials by soldering, and a method for manufacturing the same. SOLUTION : The bonded structure is composed of a first member 1 and a second member 2, and has a bonding portion 3. The first member 1 includes a substrate 1s and a carbon film 1f which coats at least a part of the surface of the substrate 1s. At least a part of the second member 2 includes a metal material 2. The bond portion 3 is formed by bonding the carbon film 1f and the metal material 2 by soldering. The carbon film 1f contains oxygen in at least the bonded interface 1j. Tin solder 3j of the bond portion 3 contains tin as a main component and one or more selected from a group of zinc and rare-earth elements. The tin solder 3j of the bond portion 3 is chemically bonded to the oxygen contained in the carbon film 1f and also is diffusion-bonded to the metal material 2 or is chemically bonded to oxygen in an oxide formed on the surface of the metal material 2. COPYRIGHT : (C)2010, JPO&INPIT |
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