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Pressure-sensitive adhesive and a removable adhesive sheet 发明授权

2023-09-18 2940 77K 0

专利信息

申请日期 2025-07-17 申请号 JP11167553
公开(公告)号 JP5201768B2 公开(公告)日 2013-06-05
公开国别 JP 申请人省市代码 全国
申请人 Nitto Denko3964
简介 A re-release type adhesive is disclosed, which, when subjected to curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release type adhesive comprises a radiation-reactive polymer having one carbon-carbon double bond and an intramolecular side chain having a chain length of 6 or more in terms of number of atoms. The release type adhesive shows a shrinkage force of 30 MPa or less as developed by curing reaction caused by irradiation with radiation. A re-release type adhesive sheet is also disclosed, comprising a substrate film and an adhesive layer comprising the re-release type adhesive, provided on one surface thereof.


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