| 简介 |
A substrate for power module (10) of the present invention includes, an insulating substrate (11), and a circuit layer (12) formed on one side of the insulating substrate (11). The circuit layer (12) is configured by joining a first copper plate (22) to one side of the insulating substrate (11). The first copper plate (22) contains, before the first copper plate (22) is joined to one side of the insulating substrate (11), any one of a total of 1 mol ppm or more to 100 mol ppm or less of at least one of alkaline-earth elements, transition metal elements, and rare earth elements or 100 mol ppm or more to 1000 mol ppm or less of boron, and the balance of the first copper plate consists of Cu and inevitable impurities. |
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