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CIRCUIT BOARD WATERPROOFING AGENT, WATERPROOFING MEMBER, WATERPROOFED CIRCUIT BOARD, AND WATERPRO 发明申请

2023-05-02 4020 102K 0

专利信息

申请日期 2025-07-08 申请号 JP2011249717
公开(公告)号 JP2013104012A 公开(公告)日 2013-05-30
公开国别 JP 申请人省市代码 全国
申请人 JSR CORP
简介 PROBLEM TO BE SOLVED : To provide a circuit board waterproofing agent which achieves satisfactory waterproofing property and electric insulation, contains no solvent, has rapid radiation curability, and ensures good working efficiency. SOLUTION : The circuit board waterproofing agent comprises : 5-50 pts.mass of (A) a compound having a structure represented by formula (1) (wherein R represents H or methyl, and mark * represents bond); 30-90 pts.mass of (B) a compound having one ethylenically unsaturated group; 0.01-10 pts.mass of (C) a radiation radical polymerization initiator; and 0.01-5 pts.mass of (D) oxides, hydroxides or salts of one or more metal elements selected from manganese, iron, cobalt, nickel, copper, zinc, calcium and rare earth elements, provided that the total amount of the components (A), (B), (C) and (D) is 100 pts.mass. COPYRIGHT : (C)2013, JPO&INPIT


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