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The semiconductor device manufacturing equipment 发明授权

2023-10-02 3240 121K 0

专利信息

申请日期 2025-07-09 申请号 JP2007100550
公开(公告)号 JP5197986B2 公开(公告)日 2013-05-15
公开国别 JP 申请人省市代码 全国
申请人 Renesas Inc302062931
简介 PROBLEM TO BE SOLVED : To enable reduction of a threshold voltage while avoiding reduction of electric characteristics in a semiconductor device using a high-k insulating film as a gate insulating film. ŽSOLUTION : A method of manufacturing a semiconductor device includes a step of preparing a silicon substrate, a step of forming a gate insulating film made of hafnium-base oxide or hafnium-based oxinitride on the silicon substrate, a step of forming a gate electrode made of a metal selected from the group of Ru, Ir, Pt, Pd, Re, W, Mo, Ni, Co and TiN and containing as Al or rare earth element as an additive element, a step of forming a source/drain region in the silicon substrate at both sides of the gate electrode, and a heat treatment step of forming an oxide film containing the additive element between the gate insulating film and the gate metal by precipitating the additive element contained in the gate electrode. ŽCOPYRIGHT : (C)2009, JPO&INPIT Ž


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