| 简介 |
PURPOSE : A method and a device for separating and collecting the components and metal substances of a printed circuit board are provided to collect all metal substances including low contents of rare metals from a printed circuit board by differently sorting electric and electronic devices and components, dust, and the components which are separated from the printed circuit board.CONSTITUTION : A method for separating and collecting the components and metal substances of a printed circuit board(PCB) includes : a step(S100) of polishing a soldering surface of a PCB using a polishing device; a step(S200) of collecting dust generated by polishing the soldering surface; a step(S300) of detaching and collecting electric and electronic devices and components attached to the surfaces of the components of the PCB; a step(S400) of separating the electric and electronic devices and components by part; and a step(S500) of respectively separating and collecting metal substances from the PCB from which the dust and the electric and electronic devices and components are detached.[Reference numerals] (AA) Start; (BB) End; (S100) Remove a metal plate and parts attached to a soldering surface of a printed circuit board; (S200) Polish the soldering surface of the printed circuit board; (S300) Collect and remove dust produced during polishing; (S400) Separate and collect electric and electronic parts attached to the printed circuit board; (S500) Separate metal substances and separate each part of electric and electronic componentsCOPYRIGHT KIPO 2013 |
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