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The transfer foil-mold, and the molded product using the same 发明授权

2023-06-30 2580 92K 0

专利信息

申请日期 2025-06-24 申请号 JP2008090614
公开(公告)号 JP5169382B2 公开(公告)日 2013-03-27
公开国别 JP 申请人省市代码 全国
申请人 Dai Nippon Printing Co Ltd2897
简介 PROBLEM TO BE SOLVED : To provide a transfer foil for in-molding having a fluorescent hologram which has such heat resistance that whitening is not caused by heat, is excellent in followability to expansion and contraction, reduced in cracking and whitening and excellent in heat resistance and light resistance and to provide a molded article using the transfer foil for in-molding. SOLUTION : The transfer foil for in-molding comprises a base material 11, a mold-released layer 13, a hologram layer 15, a transparent reflecting layer 17, a high luminance ink layer 18 and an adhesive layer 19. The mold-released layer 13 is a melamine-based resin and the hologram layer 15 is the fluorescent hologram layer including a hard coat ionization radiation-curing resin, silicone, a fluorescent rare-earth complex and a filler. The absorption wavelength region of the ionization radiation curing resin is different from the absorption wavelength region of the fluorescent rare-earth complex. COPYRIGHT : (C)2010, JPO&INPIT


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