| 简介 |
PROBLEM TO BE SOLVED : To provide a copper elemental wire for bonding wire having a low hardness and a high elongation, and further having excellent workability, and to provide a manufacturing method of the copper elemental wire for bonding wire.
SOLUTION : The copper elemental wire is used to form a bonding wire having a wire diameter of 180 μm or less. The elemental wire has a diameter between 0.15 mm and 3.0 mm inclusive, and has a composition such that at least one additive element selected from the group consisting of Mg, Ca, Sr, Ba, Ra, Zr, Ti, and rare earth elements is included in a range between 0.0001 mass% and 0.01 mass% inclusive in total, and the balance consists of copper and inevitable impurities. The special grain boundary ratio (Lσ/L), which is a ratio of the length Lσ of a special grain boundary to the length L of all of crystal grain boundaries measured by EBSD method, is 50% or larger.
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