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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 发明申请

2023-05-03 1180 187K 0

专利信息

申请日期 2025-07-12 申请号 JP2011158173
公开(公告)号 JP2013026345A 公开(公告)日 2013-02-04
公开国别 JP 申请人省市代码 全国
申请人 TOSHIBA CORP
简介 PROBLEM TO BE SOLVED : To provide a method of manufacturing a semiconductor device with high productivity and high reliability. SOLUTION : A method of manufacturing a semiconductor device according to an embodiment comprises the steps of : forming a film containing an impurity element, which is added to a semiconductor layer, on the semiconductor layer; and irradiating the film with a first gas, which is in a plasma state containing a first rare gas atom, and a second gas, which is in a plasma state containing a second rare gas atom having an atomic mass smaller than that of the first rare gas atom or hydrogen (H). COPYRIGHT : (C)2013, JPO&INPIT


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