| 申请日期 | 2025-08-27 | 申请号 | JP2006212280 |
| 公开（公告）号 | JP5124808B2 | 公开（公告）日 | 2013-01-23 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | Shin Etsu Chemical Co Ltd2060 | ||
| 简介 | An epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a cure accelerator, (E) an adhesion promoter, and (F) a metal oxide. The metal oxide (F) is a combination of a magnesium/aluminum ion exchanger, a hydrotalcite ion exchanger, and a rare earth oxide in a ratio of 0.5-20 : 0.5-20 : 0.01-10 pbw, relative to 100 pbw of epoxy resin (A) and curing agent (B) combined. | ||
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