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CERAMIC SINTERED COMPACT, CIRCUIT BOARD USING THE SAME, ELECTRONIC DEVICE AND THERMOELECTRIC CONVE 发明申请

2023-05-28 4370 718K 0

专利信息

申请日期 2025-07-16 申请号 EP11753404
公开(公告)号 EP2546216A1 公开(公告)日 2013-01-16
公开国别 EP 申请人省市代码 全国
申请人 Kyocera Corporation
简介 [Problem] There are provided a ceramic sintered body with superior thermal conductivity as well as high rigidity, a circuit board that does not crack easily, a highly reliable electronic device and a highly reliable thermoelectric conversion module. [Solution] A ceramic sintered body with superior thermal conductivity as well as high rigidity may be obtained by having a main crystalline phase predominantly composed of silicon nitride, and a grain boundary phase predominantly composed of magnesium oxide and rare-earth oxide, the grain boundary phase containing a component which is expressed in compositional formula form as : REMgSi2O5N, where RE represents rare-earth metal. Furthermore, when the ceramic sintered body is used in a circuit board, the circuit board does not crack easily and a highly reliable circuit board may be formed. An electronic device and thermoelectric conversion module that use this circuit board may be made highly reliable.


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