| 申请日期 | 2026-04-21 | 申请号 | JP2017195652 |
| 公开（公告）号 | JP2019070173A | 公开（公告）日 | 2019-05-09 |
| 公开国别 | JP | 申请人省市代码 | 全国 |
| 申请人 | C UYEMURA CO LTD | ||
| 简介 | PROBLEM TO BE SOLVED : To provide an electroless palladium plating solution that makes it possible to obtain a Pd plating coat constituting a plating coat having excellent wire bonding properties even after a thermal hysteresis. SOLUTION : An electroless palladium plating solution has a palladium compound, a reductant, a complexing agent, and at least one selected from the group consisting of Ge and rare earth elements. SELECTED DRAWING : None COPYRIGHT : (C)2019, JPO&INPIT | ||
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