客服热线:18202992950

Substrate treating method and method of manufacturing semiconductor device using the same 发明授权

2023-08-26 2670 1476K 0

专利信息

申请日期 2025-07-07 申请号 US12813823
公开(公告)号 US8324116B2 公开(公告)日 2012-12-04
公开国别 US 申请人省市代码 全国
申请人 Rita Vos; Paul Mertens; Tom Schram; Masayuki Wada
简介 A substrate treating method comprising a step of preparing a semiconductor substrate (W, 11) which has an oxide film (13, 14) containing at least one of a rare earth oxide and an alkaline earth oxide, at least a portion of the oxide film (13, 14) being exposed, and a rinse step of supplying the oxide film (13, 14) on the semiconductor substrate (W, 11) with a rinse liquid made of an alkaline chemical or an organic solvent. Preferably, the alkaline chemical is an alkaline aqueous solution having a pH of more than 7. Further, preferably, the organic solvent is a high concentration organic solvent having a concentration of substantially 100%.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4