| 简介 |
An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1, 1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1, 1-bis(2, 7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a curing agent in the form of a naphthalene type phenolic resin, (C) an inorganic filler, and (D) a rare earth oxide or hydrotalcite compound is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering. |
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