客服热线:18202992950

Epitaxial thin metal substrate for forming the clad orientation and its manufacturing method 发明授权

2023-11-09 3830 174K 0

专利信息

申请日期 2025-07-18 申请号 JP2007108606
公开(公告)号 JP5074083B2 公开(公告)日 2012-11-14
公开国别 JP 申请人省市代码 全国
申请人 Chubu Electric Power Co213297; Tanaka Kikinzoku Kogyo Co Ltd509352945
简介 The present invention provides an oriented substrate for forming an epitaxial thin film thereon, which has a more excellent orientation than that of a conventional one and a high strength, and a method for manufacturing the same. The present invention provides a clad textured metal substrate for forming the epitaxial thin film thereon, which includes a metallic layer and a copper layer bonded to at least one face of the above described metallic layer, wherein the above described copper layer has a {100} cube texture in which a deviating angle ”Õ of crystal axes satisfies ”Õ ‰¤ 6 degree. The clad textured metal substrate for forming the epitaxial thin film thereon may have an intermediate layer on the surface of the copper layer so as to form the epitaxial thin film thereon which for instance is a superconducting oxide film, wherein the above described intermediate layer preferably includes at least one layer of a material selected from the group consisting of nickel, nickel oxide, zirconium oxide, rare-earth oxide, magnesium oxide, strontium titanate (STO), strontium barium titanate (SBTO), titanium nitride, silver, palladium, gold, iridium, ruthenium, rhodium and platinum.


您还没有登录,请登录后查看下载地址


反对 0举报 0 收藏 0 打赏 0评论 0
下载排行
网站首页  |  关于我们  |  联系方式  |  使用协议  |  版权隐私  |  网站地图  |  排名推广  |  广告服务  |  积分换礼  |  网站留言  |  RSS订阅  |  违规举报  |  京ICP备2021025988号-4