| 申请日期 | 2025-07-02 | 申请号 | US13509521 |
| 公开（公告）号 | US20120280593A1 | 公开（公告）日 | 2012-11-08 |
| 公开国别 | US | 申请人省市代码 | 全国 |
| 申请人 | Franz Rinner; Markus Weiglhofer; Marion Ottlinger; Reinhard Gabl; Martin Galler; Christoph Auer; Georg Kuegerl | ||
| 简介 | A solder material can be used for fastening an outer electrode on a piezoelectric component. The solder material contains tin as the main constituent and at least one addition from the group of cobalt, tungsten, osmium, titanium, vanadium, iron and rare earth metals. A piezoelectric component includes such a solder material. The solder material is applied by means of a base metallization. | ||
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