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Gold wire for connecting the semiconductor element 发明授权

2023-08-31 5000 227K 0

专利信息

申请日期 2025-06-24 申请号 JP2008026050
公开(公告)号 JP5010495B2 公开(公告)日 2012-08-29
公开国别 JP 申请人省市代码 全国
申请人 Nippon Steel Materials Co Ltd306032316; Micro Metal Steel Co Ltd595179228
简介 PROBLEM TO BE SOLVED : To provide a gold wire for connecting semiconductors for use in complicated wiring and narrow-pitch wiring, where it is less likely to have leaning failures and is further superior in pressure-bonded shape. SOLUTION : The gold wire for connecting semiconductor elements is characterized by that nickel, beryllium and one or more elements selected from calcium and rare earth elements are added by a defined amount as essential elements, and preferably one or both of titanium and vanadium, and further praseodymium are added by a prescribed amount. COPYRIGHT : (C)2008, JPO&INPIT


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