| 简介 |
PROBLEM TO BE SOLVED : To provide a cutting method and the like for a semiconductor wafer, which can cut the wafer with small bending stress and provide a beautifully divided surface when the wafer is divided.
SOLUTION : In the cutting method for a semiconductor wafer, which cuts the semiconductor wafer along a predetermined cutting line for dividing the wafer into a plurality of semiconductor chips, the method comprises : a step of placing the wafer on a vacuum suction base which has a continuous suction face on a surface, which sucks the whole face of the wafer, and a block on a rare face, which is provided so as to be divided with a space according to a chip size; a step of sucking the whole face of the wafer on the suction face by depressurizing the suction face of the vacuum suction base; and a step of warping the sucked wafer together with the vacuum suction base and uniformly cutting the wafer in the predetermined cutting line.
COPYRIGHT : (C)2012, JPO&INPIT |
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