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COMPOSITE ABRASIVE GRAIN AND POLISHING COMPOSITION USING THE SAME 发明申请

2023-01-30 4440 328K 0

专利信息

申请日期 2025-06-25 申请号 JP2010276365
公开(公告)号 JP2012121127A 公开(公告)日 2012-06-28
公开国别 JP 申请人省市代码 全国
申请人 ADMATECHS CO LTD; RITSUMEIKAN
简介 PROBLEM TO BE SOLVED : To provide a method for producing a composite abrasive grain which enables highly accurate and efficient polishing at a low cost. SOLUTION : The composite abrasive grain comprises first inorganic particles and organic particles including second inorganic particles, the first inorganic particles adhering to the surfaces of the organic particles. For example, the first inorganic particles are ceria particles, the second inorganic particles are silica particles, and the organic particles are urethane particles. When this composite abrasive grain is used, high-rate polishing can be performed while securing surface roughness which is the same as that obtained when an abrasive grain made of only ceria particles are used. The composite abrasive grain uses less amount of ceria particles and the like containing rare earth metals, thereby achieving cost reduction and stable supply of an abrasive grain, polishing slurry and the like. COPYRIGHT : (C)2012, JPO&INPIT


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